181-044-113R171技术资料:CONN DB44 MALE HI DENSITY R/A
其它有关文件: 181-044-113R171MaterialDeclaration产品培训模块: D-SubConnectors产品目录绘图: 181SeriesFootprint 181SeriesFront 181SeriesBottom特色产品: M-SERIESD-SubConnectors3D型号: 181-044-113.pdf 181-044-113.stp 181-044-113.igs标准包装:50系列:181包装:托盘连接器样式:D-Sub,高密度连接器类型:插头,公引脚针脚数:44排数:3外壳尺寸,连接器布局:3(DB,B)高密度触头类型:信号安装类型:通孔,直角法兰特性:体座/外壳(4-40)端接:焊接特性:接地带,接地凹痕,屏蔽式外壳材料,镀层:钢,镀镍触头镀层:金触头镀层厚度:闪光侵入防护:-工作温度:-50°C~100°C额定电压:-额定电流:2A外壳材料:聚酰胺(PA9T),尼龙9T颜色:黑配套产品:6844FER-ND-CONNDB44FEMALEHDSLDCUPTIN5844FER-ND-CONNDB44FEMALEHDSLDCUPTIN4844FER-ND-CONNDB44FEMALEHDSLDCUPTINT844FER-ND-CONNDB44FEMALEHDSLDCUPTIN844FE-ND-CONNDB44FEMALEHDCRIMPNICKEL6844FE-ND-CONNDB44FEMLHDSLDCUPNICKEL5844FE-ND-CONNDB44FEMLHDSLDCUPNICKEL4844FE-ND-CONNDB44FEMLHDSLDCUPNICKELT844FE-ND-CONNDB44FEMLHDSLDCUPNICKEL